Using Additive Manufacturing Processes to Produce Optical Fiber Interconnects

SUMMARY

Award Number:

Project Title:
Using Additive Manufacturing Processes to Produce Optical Fiber Interconnects

PD/PI Names:
Roger B Tipton

Team Members:
USF, Florida High Tech Corridor, Path Optical Systems

Project/Grant Period:
09/01/2018 – 04/31/2020

Goals of the Project:
To use new additive and subtractive manufacturing tools to develop the next generation of rigid and flexible substrate optoelectronic devices and beginning with optical fiber interconnects.
The overall project goals are:
(i) Develop a process to manufacture optical fiber interconnects on PCB boards
(ii) Develop a process to manufacture optical fiber interconnects on flexible substrates.

Example of optical fiber interconnect design produced using the LE-DPAM methodology. (a) Typical layout of a three-dimensional optical fiber interconnect where the optical interconnect is built upon a flexible substrate using micro-dispensing, FDM printing, and laser ablation of the end facets which can then be populated with optical components, (b) SEM image of an optical fiber interconnect on a flexible substrate manufactured using the LE-DPAM process. The fiber runs vertically through the image and has been cut using a laser ablation process to prepare the end facet. The additional fiber and cladding will be removed, and optical components then added.

Summary of LE-DPAM process used for manufacturing an optical interconnect on a flexible substrate. (a) Liquid cladding material is first micro-dispensed onto the flexible substrate. (b) Cladding material is then cured with UV energy to create a solid but still flexible cladding material. (c) An ABS adhesive material is micro-dispensed onto the flexible substrate to help bond the optical fiber to the substrate and allowed to dry. (d) Fiber is extruded onto the ABS adhesive material on the substrate and then traversed across the cladding material to embed the optical fiber within the cladding. (e) Cladding material is then cured again, after it had been softened during the FDM printing process, with UV energy to create a solid but still flexible cladding material. (f) End facets are prepared using a subtractive laser ablation process, and finally components are mounted to the flexible substrate where communication is via the optical fiber interconnect.

Project Deliverables:
(i) Functional optical interconnect on rigid and flexible substrates
(ii) Developed models, processes conditions, and simulation of optical and mechanical performance.


Outcomes

Journal Publications:

  • R.B. Tipton, D. Hou, Z. Shi, T.M Weller, V.R. Bhethanabotla, Optical interconnects on a flexible substrate by multi-material hybrid additive and subtractive manufacturing, Additive Manufacturing Journal, 2021

  • R.B. Tipton, D. Hou, E.A. Rojas-Nastrucci, T.M. Weller, V.R. Bhethanabotla: Laser Enhanced Direct Print Additive Manufacturing of Circular Cross-Section Optical Fiber Interconnects for Board Level Computing Devices, Additive Manufacturing Journal, 2020

Patents:

  • US Provisional Patent Application 62/901,063, “Embedding of Additive Manufactured Optical Fibers into an Optical Cladding Material to Promote Round Fibers through Homogeneous Cooling” R.B. Tipton, D. Hou, E.A. Rojas-Nastrucci, T.M. Weller, V.R. Bhethanabotla was filed on 9/12/19.

  • US Patent 10,852,479, “Digital Fabrication of a Small Diameter Polymer Optical Waveguide” R.B. Tipton, J.T. Bentley, E.A. Rojas-Nastrucci, T.M. Weller, V.R. Bhethanabotla was issued on 12/1/20

Conference Publications:

  • R.B. Tipton, D. Hou, Z. Shi, T.M Weller, V.R. Bhethanabotla, A shape deposition manufacturing process for producing integrated three-dimensional flexible optoelectronics, AIChE Annual Meeting, Nov 2020

  • R.B. Tipton, D. Hou, Z. Shi, T.M Weller, V.R. Bhethanabotla, Numerical Modeling of a Fused Deposition Modeled Embedded Polymer Fiber in a Micro-Dispensed Cladding for Optical Fiber Interconnects, AIChE Annual Meeting, Nov 2020

  • R.B. Tipton, P. Das, T.M Weller, V.R. Bhethanabotla, Homogeneous Cooling Dynamics in Laser Enhanced-Direct Print Additive Manufacturing of Circular Optical Fiber Interconnects, Materials Research Society Spring/Fall Meeting, April/Dec 2020

  • R.B. Tipton, D. Hou, E.A. Rojas-Nastrucci, T.M. Weller, V. Bhethanabotla, Direct Print Additive Manufacturing of Circular Cross-Section Optical Fiber Interconnects for Board Level Computing Devices, NanoFlorida International Conference, Nov 2019

  • H. Brudi, R.B. Tipton, D. Hou, D. Hay, V.R. Bhethanabotla: Reflection technique for measuring poled PMMA’s electro-optic coefficient, Council on Undergraduate Research, Research experiences for Undergraduates Symposium, Tampa, FL, 2019

  • R.B. Tipton, D. Hou, E.A. Rojas-Nastrucci, T.M. Weller, V. Bhethanabotla, Laser Enhanced Direct Print Additive Manufacturing of Circular Cross-Section Optical Fiber Interconnects for Board Level Computing Devices, AIChE Annual Meeting, Nov 2019

  • C.E. Tolliver, R.B. Tipton, V.R. Bhethanabotla:  Direct Print Additive Manufacturing of Optical Fiber Interconnects, Leadership Alliance 2018 National Symposium (LANS), Providence, RI, 2018

  • C.E. Tolliver, R.B. Tipton, V.R. Bhethanabotla:  Direct Print Additive Manufacturing of Optical Fiber Interconnects, Council on Undergraduate Research, Research Experiences for Undergraduates Symposium, Alexandria, VA, 2018